JPS6288345U - - Google Patents
Info
- Publication number
- JPS6288345U JPS6288345U JP18011285U JP18011285U JPS6288345U JP S6288345 U JPS6288345 U JP S6288345U JP 18011285 U JP18011285 U JP 18011285U JP 18011285 U JP18011285 U JP 18011285U JP S6288345 U JPS6288345 U JP S6288345U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- normally open
- movable contact
- crossbar
- thermal overcurrent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Breakers (AREA)
- Thermally Actuated Switches (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180112U JPH0422528Y2 (en]) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985180112U JPH0422528Y2 (en]) | 1985-11-22 | 1985-11-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6288345U true JPS6288345U (en]) | 1987-06-05 |
| JPH0422528Y2 JPH0422528Y2 (en]) | 1992-05-22 |
Family
ID=31123770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985180112U Expired JPH0422528Y2 (en]) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422528Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247743U (en]) * | 1988-09-28 | 1990-04-03 | ||
| US9332164B2 (en) | 1999-12-08 | 2016-05-03 | Amkor Technology, Inc. | Molded semiconductor package with snap lid |
-
1985
- 1985-11-22 JP JP1985180112U patent/JPH0422528Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0247743U (en]) * | 1988-09-28 | 1990-04-03 | ||
| US9332164B2 (en) | 1999-12-08 | 2016-05-03 | Amkor Technology, Inc. | Molded semiconductor package with snap lid |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0422528Y2 (en]) | 1992-05-22 |